There’s a new bottleneck in the AI chipmaking process that happens almost entirely in Asia right now: advanced packaging. It connects smaller chips together into a larger chip like a GPU, so it can communicate with data centers and more. As Nvidia books the majority of capacity, TSMC prepares to break ground on its first U.S. packaging plants, and Elon Musk taps Intel for ambitious custom chip plans in Texas. CNBC got an exclusive interview with TSMC and toured an Intel packaging plant in Arizona to find out exactly how advanced packaging works and why capacity is ramping up fast.
Chapters:
00:00 – Introduction
2:25 – Rise of advanced packaging
5:57 – From 2D to 3D
10:39 – U.S. packaging capacity
Produced and Shot by: Katie Tarasov
Edited by: Evan Lee Miller
Camera by: Marc Ganley, Tony Puyol
Senior Director of Video: Jeniece Pettitt
Animation: Jason Reginato, Emily Park
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Nvidia Booked The Majority Of TSMC’s Capacity Of A Crucial Chipmaking Step
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